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Tech & Mfg Rotation Program - Packaging Engineer

at Texas Instruments Incorporated

Posted: 9/21/2019
Job Reference #: 418480
Keywords:

Job Description

Job ID
24710BR

Job Posting Title
Tech & Mfg Rotation Program - Packaging Engineer

Job Description
As a global semiconductor company operating in 35 countries, Texas Instruments (TI) is first and foremost a reflection of its people. From the TIer who unveiled the first working integrated circuit in 1958 to the more than 30,000 TIers around the world today who design, manufacture and sell analog and embedded processing chips, we are problem-solvers collaborating to change the world through technology. Put your talent to work with us – change the world, love your job!

About the Job
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. Thrive in a fast paced and dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging Engineers play an important role at Texas Instruments which encompasses the following responsibilities and skills:
- Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
- Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
- Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
- Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
Life at TI as a Packaging Engineer: Enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.

Experience two different assignments – start in a challenging role inside a TI manufacturing site or on an engineering team, and after 18-24 months you’ll rotate to a second role designed to broaden your experiences and grow your expertise.

Minimum Requirements:
• A Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science, Physics or Electrical Engineering.
• Minimum Cumulative 3.0/4.0 GPA, or higher

Additional Preferred Qualifications:
• Basic understanding of statistical process control (SPC
• Semiconductor packaging knowledge is preferred
• Demonstrated analytical and problem solving skills
• Strong written and verbal communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results

Impact people’s lives: Create the products and technologies that will go into end products such as desktop PCs, MP3 players, blood pressure monitors, cameras, DVR & DVS’, e-book, ECG electrocardiogram, ultrasound system, tablets, automotive and so many more-The possibilities are literally endless!

To be considered for this position, please apply to this requisition.

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to protected characteristics, including race, color, religion, sex, national origin, disability, veteran status, sexual orientation, gender identity or age.


Job Opening Type
Co-Op Conversion

Minimum Education Level
Bachelor's Level Degree

Related Field(s) of Study
Chemical Engineering
Electrical Engineering
Materials Science
Mechanical Engineering
Physics


Minimum Years of Experience
0

Regular / Temporary
Regular

Full-time / Part-time
Full-Time

Country
United States

Job Location(s)
USA-Texas-Dallas Metroplex

Virtual / Telecommute
No